Characterization of Epoxy Glues with FTIR

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Abstract
Adhesives have been used since ancient times, but in the mid-19509, when new polymeric adhesives were introduced, the concept of glues changed dramatically. These new adhesives have become the predominant method for fastening materials together. Adhesive glues can be classified as thermoplastic o r thermosetting. The thermoplastic category includes hot melts, cyanoacrylates, solutions (acetates, acrylics), and dispersions (synthetic rubber, latex). Thermoplastics soften when heated, are soluble in at least a few solvents, and tend to creep (undergo permanent change in dimension) under stress. They are composed of long linear chains lying together, but the three dimensions are not interconnected. On the other hand, thermosetting adhesives do not deform readily. They are insoluble in nearly all solvents, so analysis is difficult. The polymer chain segments are cross linked in all three dimensions, making deformation difficult o r impossible at room temperature. In addition to phenolics, polyurethanes, and silicones, epoxies are classified as thermosetting adhesives. Epoxy glues are used to bond metals, glass, ceramics, plastics, wood, concrete, and many other surfaces. Their strength, versatility, and excellent adhesion to a variety of surfaces in addition to their ease of use have made epoxies an important commercial product as well as invaluable to industry [1].