Thermal and electrical properties of copper-tin and nickel-tin intermetallics
- 1 October 1992
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 72 (7) , 2879-2882
- https://doi.org/10.1063/1.351487
Abstract
The thermal diffusivity, electrical resistivity, density, and heat capacity have been measured for Cu6Sn5, Cu3Sn, and Ni3Sn4. These properties were used to evaluate the apparent Lorenz number for comparison with the theoretical value. Acceptable agreement was found.This publication has 2 references indexed in Scilit:
- Heat conductivity of oxide coatings by photothermal radiometry between 293 and 1173 KApplied Optics, 1988
- An x-ray diffraction and calorimetric investigation of the compound Cu6Sn5Metallurgical Transactions, 1973