Flip chip process development techniques using a modified laboratory aligner bonder
- 19 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Flip Chip Technology: A Method for Providing Known Good Die with High Density InterconnectionsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Fluxless soldering in air and nitrogenPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Smart MEMS: flip chip integration of MEMS and electronicsPublished by SPIE-Intl Soc Optical Eng ,1995
- Application of ESEM to fluxless solderingMicroscopy Research and Technique, 1993