Up- and down-converter chip set for LMDS using three-dimensional masterslice MMIC technology
- 20 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Highly integrated three-dimensional MMIC technology applied to novel masterslice GaAs- and Si-MMICsIEEE Journal of Solid-State Circuits, 1997
- Miniaturized three-dimensional MMIC K-band upconverterIEEE Microwave and Guided Wave Letters, 1997