Predicting delamination in plastic IC packages and determining suitable mold compound properties
- 1 May 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 17 (2) , 201-208
- https://doi.org/10.1109/96.330428
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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