Accurate measurement of high-speed package and interconnect parasitics

6 January 2003

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 23.3/1-23.3/7
https://doi.org/10.1109/cicc.1988.20920

Abstract

Various ideal structures such as small resistors, shorts, and transmission lines are used to verify the calibration of the measurement instrument at the probe tip. Typical measurements of package and interconnect performance are demonstrated, and sample measurements are made, including time domain reflectometry, propagation delay, isolation, and bypassing of power lines. Measurement results are shown.

Keywords

PACKAGING
TRANSMISSION LINE MEASUREMENTS
POWER MEASUREMENT
TIME MEASUREMENT
RESISTORS
POWER TRANSMISSION LINES
CALIBRATION
INSTRUMENTS
PROBES
REFLECTOMETRY

This publication has 1 reference indexed in Scilit:

Electrical Characterization of Packages for High-Speed Integrated Circuits
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985