A pillar-shaped via structure in a Cu-polyimide multilayer substrate
- 13 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Buried Coaxial Conductors for High-Speed InterconnectionsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Copper/polyimide Materials System for High Performance PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984