Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test
- 15 July 2004
- journal article
- Published by Elsevier in Scripta Materialia
- Vol. 51 (7) , 641-645
- https://doi.org/10.1016/j.scriptamat.2004.06.027
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Mechanical Strength and Microstructure of BGA Joints Using Lead-Free SoldersMATERIALS TRANSACTIONS, 2002
- Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrateJournal of Materials Science: Materials in Electronics, 2000
- Thermodynamic prediction of interface phases at Cu/solder jointsJournal of Electronic Materials, 1998