An integrated approach to flow, thermal and mechanical modeling of electronics devices
- 25 June 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Modelling the fatigue life of solder joints for surface mount resistorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Multiphysics modelling for electronics designPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Coffin-Manson fatigue model of underfilled flip-chipsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997