Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses
- 1 October 1999
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (10) , 1138-1143
- https://doi.org/10.1007/s11664-999-0251-3
Abstract
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This publication has 1 reference indexed in Scilit:
- Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis *Soldering & Surface Mount Technology, 1996