Novel thermally reworkable underfill encapsulants for flip-chip applications
- 1 January 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Advanced Packaging
- Vol. 22 (1) , 46-53
- https://doi.org/10.1109/6040.746542
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Encapsulants used in flip-chip packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Novel thermally reworkable underfill encapsulants for flip-chip applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Repairability of underfill encapsulated flip-chip packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Cleavable epoxy resins: Design for disassembly of a thermosetJournal of Polymer Science Part A: Polymer Chemistry, 1996