Growth of Silicon-Doped and High Quality, Highly Resistive GaN for FET Applications
- 1 January 1995
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
We have shown the ability to grow thin, high mobility, GaN channel layers on high quality, highly resistive GaN. The growth, characteristics, and device results of two types of MESFET structures were discussed. The first device structure consists of a 2000Ǻ, 2 × 1017cm−3 Si-doped channel layer, grown on 3µm of highly resistive GaN, while die second structure (recessed-gate MESFET) had a 1000Ǻ, 1 × 1018cm−3 Si-doped, n+ capping layer deposited on a 2000Ǻ, 2 × 1017cm−3 Si-doped channel layer. The first MESFET structure was operational at 500°C which is the highest reported operating temperature for a GaN device while the recessed-gate MESFET had a gmas high as 41mS/mm, which is the highest reported value for a GaN MESFET.Keywords
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