Reliability and moisture sensitivity evaluation of 225-pin, 2 layered overmolded (OMPAC) ball grid array package
- 19 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 434-439
- https://doi.org/10.1109/ectc.1995.515318
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Accelerated life performance of moisture damaged plastic surface mount devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993