Measurement of Adhesive Force Between Mold and Photocurable Resin in Imprint Technology

• 30 June 2002
• journal article
• Published by IOP Publishing in Japanese Journal of Applied Physics
• Vol. 41  (Part 1, No) , 4194-4197
• https://doi.org/10.1143/jjap.41.4194

Abstract

Keywords

• TENSILE TEST
• FRACTURE ENERGY
• ADHESIVE FORCE