The wetting transition in high and low energy grain boundaries in the Cu(In) system
- 1 May 1992
- journal article
- Published by Elsevier in Acta Metallurgica et Materialia
- Vol. 40 (5) , 939-945
- https://doi.org/10.1016/0956-7151(92)90070-u
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- Instability of grain boundary grooves due to equilibrium grain boundary diffusionActa Metallurgica et Materialia, 1991
- Penetration of tin and zinc along tilt grain boundaries 43° [100] in Fe-5 at.% Si alloy: Premelting phase transition?Acta Metallurgica et Materialia, 1991
- Melting of CuIn solid solutions at small superheating by droplet formation and liquid film migrationActa Metallurgica, 1989
- Wetting: statics and dynamicsReviews of Modern Physics, 1985
- Solid-liquid interfacial tensions by the dihedral angle method. A mathematical approachActa Metallurgica, 1985
- Interfacial tensions and adsorption in the AgPb systemScripta Metallurgica, 1982
- The classification of order-disorder transitions on surfacesProgress in Surface Science, 1981
- Critical point wettingThe Journal of Chemical Physics, 1977
- Interfacial tensions in Zn, Zn-Sn and Zn-Sn-Pb systemsJournal of the Less Common Metals, 1977
- Tension interfaciale solide-liquide des systémes Al-Sn, Al-In et Al-Sn-InJournal of Crystal Growth, 1976