Coffin-Manson based fatigue analysis of underfilled DCAs
- 1 December 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 21 (4) , 577-584
- https://doi.org/10.1109/95.740050
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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