High‐Temperature Fracture Mechanism of Low‐Ca‐Doped Silicon Nitride
- 1 March 1995
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 78 (3) , 673-679
- https://doi.org/10.1111/j.1151-2916.1995.tb08231.x
Abstract
No abstract availableKeywords
This publication has 20 references indexed in Scilit:
- Calcium Concentration Dependence of the Intergranular Film Thickness in Silicon NitrideJournal of the American Ceramic Society, 1994
- Evaluation of the Strength and Creep–Fatigue Behavior of Hot Isostatically Pressed Silicon NitrideJournal of the American Ceramic Society, 1992
- Evaluation of Slow Crack Growth Resistance in Ceramics for High‐Temperature ApplicationsJournal of the American Ceramic Society, 1992
- Improved Analysis for Flexural Creep with Application to Sialon CeramicsJournal of the American Ceramic Society, 1990
- Damage‐Enhanced Creep in a Siliconized Silicon Carbide: Mechanics of DeformationJournal of the American Ceramic Society, 1988
- Relationships between processing, microstructure and properties of dense and reaction-bonded silicon nitrideJournal of Materials Science, 1987
- The Role of Grain‐Boundary Sliding in Fracture of Hot‐Pressed Si3N4 at High TemperaturesJournal of the American Ceramic Society, 1980
- Oxidation of Si3N4 Alloys: Relation to Phase Equilibria in the System Si3N4‐SiO2‐MgOJournal of the American Ceramic Society, 1980
- High‐Temperature Strength Behavior of Hot‐Pressed Si3N4: Evidence for Subcritical Crack GrowthJournal of the American Ceramic Society, 1974
- Calculation of Stresses and Strains in Four‐Point Bending Creep TestsJournal of the American Ceramic Society, 1971