Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique
- 1 November 1999
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (11) , 1270-1275
- https://doi.org/10.1007/s11664-999-0167-y
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Thermal Fatigue Damage in the Solder Joints of Leadless Chip ResistorsJournal of Electronic Packaging, 1994
- Converting to lead-free solders: An automotive industry perspectiveJOM, 1993
- Predictive thermal and mechanical modeling of a developmental MCMJOM, 1992
- Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder jointsJournal of Electronic Materials, 1991