Topographic Imperfections in Zone Melting Recrystallized Si Films on SiO2

Abstract
The principal topographic imperfections in Si films recrystallized on by the graphite‐strip‐heater technique have been examined. Wafer warpage has been reduced to less than 4 μm for 2 in. diam samples. The protrusion density decreases with finer sub‐boundary spacing; this correlation can be understood in terms of the thermal gradient present at the liquid‐solid interface.

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