Chemical Vapor Deposition of Tungsten (CVD W) as Submicron Interconnection and Via Stud
- 1 July 1989
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 136 (7) , 2108-2112
- https://doi.org/10.1149/1.2097203
Abstract
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