In Situ Tensile Strength Measurement Of Thick-film And Thin Film Micromacrined Structures
- 25 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2, 56-59
- https://doi.org/10.1109/sensor.1995.721743
Abstract
A method is introduced where tensile tests can be performed in situ on micromachined structures by using a micromainpulator in a Scanning Electron Microscope. The fracture loads of micromachined structures made from thick-film and thin-film polysilicon were measured, and the fracture strength of the films evaluated with Weibull statistics.Keywords
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