A transverse-wave ultrasonic oblique-incidence technique for interfacial weakness detection in adhesive bonds
- 15 January 1988
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 63 (2) , 300-307
- https://doi.org/10.1063/1.340294
Abstract
The possibility of using an ultrasonic oblique-incidence technique for improved sensitivity in interfacial weakness detection in adhesive bonds was considered. The analysis of the sensitivity of transverse waves to interface imperfections on an interface between two semi-infinite half-spaces with bond rigidities of various finite values was carried out. Excellent sensitivity is obtained for discriminating bond weaknesses from a perfect or welded situation to a poor or smooth situation compared to longitudinal wave impingement and reflection. The optimal angle of incidence for the inspection of an aluminum-to-aluminum adhesively bonded structure in an immersion technique is presented. Additionally, a signal feature in frequency domain for adhesive and cohesive weakness distinction is proposed.This publication has 7 references indexed in Scilit:
- A model for transverse wave sensitivity to poor adhesion in adhesively bonded jointsThe Journal of the Acoustical Society of America, 1986
- Study of adhesive bonds using low-frequency obliquely incident ultrasonic wavesThe Journal of the Acoustical Society of America, 1986
- Shear modulus gradients in adhesive interfaces as determined by means of ultrasonic Rayleigh wavesJournal of Applied Physics, 1982
- An ultrasonic interface-wave method for predicting the strength of adhesive bondsJournal of Applied Physics, 1981
- Elastic wave behavior across linear slip interfacesThe Journal of the Acoustical Society of America, 1980
- Waves at a Flexibly Bonded InterfaceJournal of Applied Mechanics, 1967
- Elastic Wave Mode Conversion at a Solid-Solid Boundary with Transverse SlipThe Journal of the Acoustical Society of America, 1961