Aluminum composite materials for multichip modules

• 1 July 1992
• journal article
• multichip module-packaging
• Published by Springer Nature in JOM
• Vol. 44  (7) , 24-28
• https://doi.org/10.1007/bf03222271

Abstract

Keywords

• PRODUCT LITERATURE
• SQUEEZE CASTING
• PRESSURELESS INFILTRATION
• MULTICHIP MODULE
• SPECIFIC THERMAL CONDUCTIVITY