FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS

• 1 December 1995
• journal article
• research article
• Published by World Scientific Pub Co Pte Ltd in Journal of Electronics Manufacturing
• Vol. 05  (04) , 273-276
• https://doi.org/10.1142/s0960313195000281

Abstract

Keywords

• VARIOUS SUBSTRATES
• CHIP INTERCONNECTION
• FLIP CHIP
• ELECTRICAL CONTACTS
• MECHANICAL CONTACT
• INTERCONNECTION RESISTANCE
• GOLD
• INTERCONNECTION TO VARIOUS