Laser processing of palladium for selective electroless copper plating
- 1 February 1994
- proceedings article
- Published by SPIE-Intl Soc Optical Eng
- Vol. 2045, 330-338
- https://doi.org/10.1117/12.167577
Abstract
Various methods for laser-assisted activation of dielectric layers for selective electroless copper plating are investigated. The direct writing of palladium feature by the Ar+ laser-induced pyrolytic decomposition of an organometallic palladium resin on polyimide and Si3N4 leads to active Pd sites which are selectively copper plated. Other laser-induced processes for selective palladium seeding are studied. It is also shown that those are efficient seeding processes for the electroless plating of copper.Keywords
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