Electromigration in Al/Cu thin films with polyimide passivation

• 11 September 1981
• journal article
• abstracts
• Published by Elsevier in Thin Solid Films
• Vol. 83  (2) , 207
• https://doi.org/10.1016/0040-6090(81)90667-2

Abstract

Keywords

• THIN FILMS
• POLYIMIDE PASSIVATION
• AL/CU THIN
• ELECTROMIGRATION IN AL/CU