Mechanical Testing of Thicker MEMS Materials

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Abstract
Techniques are described for recording the complete stress-strain curve of nickel microspecimens that are 3 millimeters long and 0.2 millimeters thick and wide. These specimens are fabricated by electrodeposition using the LIGA technique and are typical of the material that would be used in larger microelectromechanical systems (MEMS). Pure nickel deposited in this manner has a yield stress on the order of 300 MPa in contrast to the value of 60 MPa for the bulk material.

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