An improved approach to electroless copper deposition on non-conducting substrates
- 30 September 1984
- journal article
- research article
- Published by Elsevier in Solid-State Electronics
- Vol. 27 (8-9) , 828-829
- https://doi.org/10.1016/0038-1101(84)90037-6
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Improved electroless process of copper coating ceramics. 1. Some parameters of coating glass substratesProceedings of the Indian Academy of Sciences Section C: Engineering Sciences, 1980
- The Rate of Electroless Copper Depositionby Formaldehyde ReductionJournal of the Electrochemical Society, 1974
- The Nucleation, Growth, and Structure of Electroless Copper DepositsJournal of the Electrochemical Society, 1970