Flow processes in solder paste during stencil printing for SMT assembly

• 1 February 1995
• journal article
• research article
• Published by Springer Nature in Journal of Materials Science: Materials in Electronics
• Vol. 6  (1) , 34-42
• https://doi.org/10.1007/bf00208132

Abstract

Keywords

• RHEOLOGICAL PROPERTY
• MATERIAL PROCESSING
• FLOW PROCESS
• DENSE SUSPENSION
• METAL MASK