The Use of Selective Annealing for Growing Very Large Grains in Silicon on Insulator Films

Abstract
The selective annealing technique (laser annealing under patterned antireflecting coating) has been successfully applied to the growth of very large (20 µm × 3000 µm) silicon single crystals. The grain boundary location is controlled by a conventional lithography step, and the grains obtained have a nearly perfect rectangular shape.

This publication has 0 references indexed in Scilit: