Mechanical Behavior of Sapphire Whiskers at Elevated Temperatures
- 1 January 1962
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 33 (1) , 33-39
- https://doi.org/10.1063/1.1728523
Abstract
The tensile behavior of sapphire whiskers was measured at temperatures ranging from 25–2030°C. At room temperature, the tensile strength of the whiskers is size dependent and varies from several hundred thousand psi to 1 500 000 psi. With increasing temperature the strength decreases and becomes less size dependent. The whiskers exhibit delayed fracture above 630°C, the time to fracture being exponentionally related to the applied stress. Delayed fracture occurs in both hydrogen and oxygen atmospheres and hence is not believed to be due to stress corrosion. The mechanical behavior of the whiskers has been rationalized by assuming that they are essentially dislocation free and that failure occurs by thermally activated crack propagation preceded, at high temperatures, by localized dislocation nucleation.This publication has 13 references indexed in Scilit:
- On microcreep in zinc whiskersPhilosophical Magazine, 1960
- Growth of Aluminum Oxide Whiskers by Vapor DepositionThe Journal of Chemical Physics, 1959
- Mechanical behavior of microcrystalsActa Metallurgica, 1958
- Growth and Defect Structure of Sapphire MicrocrystalsJournal of Applied Physics, 1957
- Plastic Deformation of Ceramic‐Oxide Single Crystals, IIJournal of the American Ceramic Society, 1957
- Plastic deformation of single crystals of sapphire: Basal slip and twinningActa Metallurgica, 1957
- Plastic Deformation of Copper and Silver WhiskersJournal of Applied Physics, 1957
- Deformation and fracture of small silicon crystalsActa Metallurgica, 1957
- Plastic Deformation of Ceramic‐Oxide Single CrystalsJournal of the American Ceramic Society, 1954
- VI. The phenomena of rupture and flow in solidsPhilosophical Transactions of the Royal Society A, 1921