Changes in the Microstructures of Silver-Tin and Admixed High-copper Amalgams During Creep

Abstract
The microstructures of an Ag-Sn amalgam and an admixed high-copper amalgam have been observed during compressive creep tests. Sliding of γ1 grains has been observed. The sliding rate is much lower in the γ2-free high-copper amalgam than in the γ2-containing Ag-Sn amalgam.