Capillary bonded components for injection laser transmitter modules
- 8 July 1982
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 18 (14) , 629-630
- https://doi.org/10.1049/el:19820430
Abstract
The packaging of semiconductor lasers with fibre-optic and electronic components is described, based on the use of an Si chip as a common substrate. The components are attached by flowing solder in grooves underneath the components by capillary action. The modules are small in dimension, and fabricated using automatable techniques for low cost.Keywords
This publication has 0 references indexed in Scilit: