Electrical design of an MCM package for a multi-processor digital system
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 18 (1) , 127-143
- https://doi.org/10.1109/96.365499
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologiesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1994
- Hiding shared memory reference latency on the Galactica Net distributed shared memory architectureJournal of Parallel and Distributed Computing, 1992
- An electromagnetic approach for modeling high-performance computer packagesIBM Journal of Research and Development, 1990