Characterizing the failure envelope of a conductive adhesive

Publisher Website

22 November 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/isapm.1997.581274

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Lead free interconnect materials for the electronics industry
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
New high conductivity lead (Pb)-free conducting adhesives
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002