Abstract
Removal of a radioactive implant (212Pb + 212Bi) from the glass surface was measured during reactive (CF4) and argon ion etching and accompanying changes in the surface composition were determined using ESCA. During reactive etch in CF4 the formation of fluoride (Na, Ca, Mg) surface layer was observed. High etching rate at low pressure of CF4 can be explained by the combined action of the reactive etch of the silica component and RF sputtering of the residual non-volatile fluorides.

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