Packaging Reliability-How to Define and Measure It
- 1 December 1982
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 5 (4) , 454-462
- https://doi.org/10.1109/tchmt.1982.1135999
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Electrochemical Model for Corrosion of Conductors on Ceramic SubstratesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
- Corrosion of In-Base SoldersPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1978
- Lead-Indium for Controlled-Collapse Chip JoiningIEEE Transactions on Parts, Hybrids, and Packaging, 1977
- Reliability of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969