Determining the stress–strain behaviour of small devices by nanoindentation in combination with inverse methods
- 10 April 2003
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 67-68, 818-825
- https://doi.org/10.1016/s0167-9317(03)00192-8
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- WWWUbiquity, 2002
- Computational modeling of the forward and reverse problems in instrumented sharp indentationActa Materialia, 2001
- Identification of the constitutive equation by the indentation technique using plural indenters with different apex anglesJournal of Materials Research, 2001
- Mechanical Testing of Thin Films and Small StructuresAdvanced Engineering Materials, 2001
- Finite element simulation of microindentation on aluminumJournal of Materials Science, 2001
- Determination of constitutive properties of thin metallic films on substrates by spherical indentation using neural networksInternational Journal of Solids and Structures, 2000
- Size effects in materials due to microstructural and dimensional constraints: a comparative reviewActa Materialia, 1998
- Analysis of Berkovich indentationInternational Journal of Solids and Structures, 1996
- An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experimentsJournal of Materials Research, 1992
- A method for interpreting the data from depth-sensing indentation instrumentsJournal of Materials Research, 1986