Cu0, Cu+, and Cu2 from excimer-ablated copper
- 1 February 1991
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 69 (3) , 1721-1729
- https://doi.org/10.1063/1.347218
Abstract
Bulk copper is laser etched with 193‐ and 351‐nm excimer radiation. The transition from the thermal to the plasma etch region is studied by measuring the densities and kinetic energies of three copper species (Cu0, Cu+, and Cu2 ) in the etch plume. A unique laser‐induced fluorescence experiment allows these three species to be followed essentially simultaneously as a function of fluence. Three separate types of etching behavior are clearly evident (even within the small fluence range of ∼1–12.5 J/cm2 ); i.e., thermal vaporization of Cu, multiphoton ionization of the Cu vapor, and electron‐atom collision‐induced ionization (breakdown) and dissociation (of Cu2 ).This publication has 18 references indexed in Scilit:
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