A Correlation of Material Toughness, Thermal Shock Resistance, and Microstructure of High Tungsten, Silver-Tungsten Composite Materials
- 1 March 1975
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 11 (1) , 21-29
- https://doi.org/10.1109/tphp.1975.1135028
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- THE APPLICATION OF FRACTURE MECHANICS TO CEMENTED TUNGSTEN CARBIDESPowder Metallurgy, 1971