Non-destructive determination of residual stresses in circular silicon wafers
- 1 March 1984
- journal article
- Published by Elsevier in Mechanics Research Communications
- Vol. 11 (2) , 97-104
- https://doi.org/10.1016/0093-6413(84)90017-x
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Nondestructive residual-stress measurement in a wide-flanged rolled beam by acoustoelasticityExperimental Mechanics, 1983
- “PARS”—A Portable X-Ray Analyzer for Residual StressesJournal of Testing and Evaluation, 1978
- Experimental and analytical strains in an edge-cracked sheetEngineering Fracture Mechanics, 1971
- MEASUREMENT OF NON‐UNIFORM BI‐AXIAL RESIDUAL STRESSES BY THE HOLE DRILLING METHODStrain, 1968