Electrode slotting process for thin PLZT wafers

Abstract
A new electroding technique entitled the electrode slotting process (ESP) has been developed for electroding 0.38-mm thick PLZT wafers for bonded lens assemblies in the USAF EEU-2/P Thermal/Flash Protective Goggle. The electrodes are formed by first cutting a mirror-image pattern of shallow interdigital slots on both sides of the PLZT wafer followed by an electroless plating of these slots and the wafer edge. Experimental results of operating voltage and closed state optical density with respect to variations in slot depth and electrode geometry are also discussed.

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