Diamond deposition on silicon surfaces heated to temperature as low as 135 °C

Abstract
Diamond films were deposited on the silicon wafer at as low a temperature as 135 °C by filament-assisted chemical vapor deposition. Silicon wafer substrate scratched with diamond powder was cooled by a stream of water flowing around a substrate holder. The films were identified as diamond by Raman spectroscopy. Clearly faceted crystals were shown in scanning electron micrographs.

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