Sub-centimeter micromachined electron microscope

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Abstract
A new approach for fabricating macroscopic (∼10×10×10 mm3) structures with micrometer accuracy has been developed. This approach combines the precision of semiconductor processing and fiber optic technologies. A (100) silicon wafer is anisotropically etched to create four orthogonal v‐grooves and an aperture on each 10×12 mm die. Precision 308 μm optical fibers are sandwiched between the die to align the v‐grooves. The fiber is then anodically bonded to the die above and below it. This procedure is repeated to create thick structures and a stack of 5 or 6 die will be used to create a miniature scanning electron microscope (MSEM). Two die in the structure will have a segmented electrode to deflect the beam and correct for astigmatism. The entire structure is ultrahigh vacuum compatible. The performance of a SEM improves as its length is reduced and a sub‐cm 2 keV MSEM with a field emission source should have approximately 1 nm resolution. A low‐voltage high‐resolution MSEM would be useful for the examination of biological specimens and semiconductors with a minimum of damage. The first MSEM will be tested with existing 6 μm thermionic sources. In the future a micromachined field emission source will be used. The stacking technology presented in this paper can produce an array of MSEMs 1–30 mm in length with a 1 mm or larger period. A key question being addressed by this research is the optimum size for a low‐voltage MSEM which will be determined by the required spatial resolution, field of view, and working distance.

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