Low‐Temperature Sintering of Alumina with Liquid‐Forming Additives
- 1 August 1991
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 74 (8) , 2011-2013
- https://doi.org/10.1111/j.1151-2916.1991.tb07825.x
Abstract
Simultaneous application of colloidal processing and liquid‐forming additives to alumina resulted in a sintered density of >99% in 1 h at a temperature as low as 1070°C for a commercial high‐purity alumina powder at a total dopant level of 2 mol%. The additives were 0.9% CuO + 0.9% TiO2+ 0.1% B2O3+ 0.1% MgO. At higher temperatures or after prolonged sintering, the doped alumina ceramic developed a duplex microstructure containing large elongated grains and exhibited a relatively high fracture toughness of ∼ 3.8 MPa · m1/2 as compared to a value of ∼ 2.6 MPa · m1/2 for the undoped alumina.Keywords
This publication has 14 references indexed in Scilit:
- Deformation and Grain Growth of Low‐Temperature‐Sintered High‐Purity AluminaJournal of the American Ceramic Society, 1990
- Origin and Growth Kinetics of Platelike Abnormal Grains in Liquid‐Phase‐Sintered AluminaJournal of the American Ceramic Society, 1990
- Powder Processing Science and Technology for Increased ReliabilityJournal of the American Ceramic Society, 1989
- Low‐Temperature Sintering of Aluminum OxideJournal of the American Ceramic Society, 1988
- Effect of a Liquid Phase on the Morphology of Grain Growth in AluminaJournal of the American Ceramic Society, 1987
- Sinterability of Agglomerated PowdersJournal of the American Ceramic Society, 1984
- Agglomerate and Particle Size Effects on Sintering Yttria‐Stabilized ZirconiaJournal of the American Ceramic Society, 1981
- Effect of TiO2 on Initial Sintering of Al2O3Journal of the American Ceramic Society, 1970
- Mass Transport and Sintering in Impure Ionic SolidsJournal of the American Ceramic Society, 1966
- Effect of Change of Scale on Sintering PhenomenaJournal of Applied Physics, 1950