Polarographic studies on the effect of thiourea on deposition of copper in the presence of 2M H2SO4
- 1 April 1977
- journal article
- Published by Elsevier in Electrochimica Acta
- Vol. 22 (4) , 359-364
- https://doi.org/10.1016/0013-4686(77)85087-1
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Polarographic studies on aqueous formamidine disulphide solutions—IElectrochimica Acta, 1975
- The system copper (II)-thiourea in 0·1 N nitric acidJournal of Inorganic and Nuclear Chemistry, 1974
- Stabilization of oxidation state two of copper in thiourea complexesInorganica Chimica Acta, 1972
- Aspects du comportement de la thiourée en solution cuivriqueElectrochimica Acta, 1969
- Electron spectroscopic evidence of the thiolsulphonate structure of cystine S-dioxideSpectrochimica Acta Part A: Molecular Spectroscopy, 1967
- Adsorption of organic compounds at the metal/solution interface: Thiourea on gold electrodesElectrochimica Acta, 1963
- The structure of the mercury-electrolyte interphase in the presence of thioureaProceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, 1961
- Polarography of Copper Complexes. II. Dipyridyl, Orthophenanthroline and Thiourea Complexes. A Double Complex System1Journal of the American Chemical Society, 1950