Organosilicon Films Formed by an RF Plasma Polymerization Process

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Abstract
The purpose of this research was to develop a plasma polymerization process for producing polymeric films and to achieve an understanding of the chemistry involved. A technique for the production of polymer coatings from a capacitively coupled RF plasma is presented. The resulting films contain trapped free radical sites which can react with oxygen and nitric oxide. The rate of polymer formation is a complicated function of power input, total system pressure, and partial pressure of monomer. The rates of reaction differ for different monomers under identical reaction conditions. The stoichiometry and infrared spectra of the polymers indicate that considerable fragmentation and bond reorganization of the monomeric starting material occurs during the polymerization process. A mechanism is proposed to account for conversion of monomer to polymer by formation and fragmentation of ionic species in the discharge. Neutralization of the ionic fragments at the walls yields radicals which can react with adsorbed species and be cross‐linked to form polymer.

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