Development Of "The Maple Method"

• 24 August 2005
• conference paper
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• p. 187-190
• https://doi.org/10.1109/iemt.1993.639748

Abstract

Keywords

• BONDING
• GLASS
• SUBSTRATES
• COSTS
• ASSEMBLY
• ACTIVE MATRIX TECHNOLOGY
• LARGE SCALE INTEGRATION
• ANISOTROPIC CONDUCTIVE FILMS
• OPTIMIZED PRODUCTION TECHNOLOGY
• ACTIVE MATRIX LIQUID CRYSTAL DISPLAYS