Evolution of the Microstructure and Performance of Pd/Ag ‐ BasedThick Conductors
Open Access
- 18 September 1984
- journal article
- research article
- Published by Wiley in Active and Passive Electronic Components
- Vol. 12 (1) , 41-57
- https://doi.org/10.1155/1985/21431
Abstract
Pd/Ag‐based inks are probably the most commonly used conductors in thick‐film hybrid technology. The evolution of the microstructure of these films was studied on samples fired with isochronal cycles at a peak temperature in the range from 300℃ up to 850℃. The samples were investigated by means of X‐ray diffraction, SEM and EDAX analysis techniques; the results of these analyses as well as those of thermogravimetry (TG, DTG) and differential thermal analysis (DTA), enable one to obtain a clear picture of the complex evolution of the microstructure of these conductors, which correlates quite strictly with the performance of the films in terms of resistivity and adhesion.The relevance and limitations of each analytical technique for the examination of thick‐film conductors are emphasized.Keywords
Funding Information
- Consiglio Nazionale delle Ricerche
This publication has 0 references indexed in Scilit: