Fast-flow underfill encapsulant: flow rate and coefficient of thermal expansion
- 1 June 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 21 (2) , 360-364
- https://doi.org/10.1109/95.705485
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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